Co-packaged photonics for high performance computing: status, challenges and opportunities

R Mahajan, X Li, J Fryman, Z Zhang… - Journal of Lightwave …, 2021 - ieeexplore.ieee.org
Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …

Co-packaged optics (CPO): status, challenges, and solutions

M Tan, J Xu, S Liu, J Feng, H Zhang, C Yao… - Frontiers of …, 2023 - Springer
Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter
traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three …

[HTML][HTML] InP photonic integrated multi-layer neural networks: Architecture and performance analysis

B Shi, N Calabretta, R Stabile - APL Photonics, 2022 - pubs.aip.org
We demonstrate the use of a wavelength converter, based on cross-gain modulation in a
semiconductor optical amplifier (SOA), as a nonlinear function co-integrated within an all …

A 240 Gb/s PAM4 silicon micro-ring optical modulator

M Sakib, R Kumar, C Ma, D Huang… - 2022 Optical Fiber …, 2022 - ieeexplore.ieee.org
A 240 Gb/s PAM4 Silicon Micro-Ring Optical Modulator Page 1 A 240 Gb/s PAM4 Silicon
Micro-Ring Optical Modulator Meer Sakib, Ranjeet Kumar, Chaoxuan Ma, Duanni Huang, Xinru …

[HTML][HTML] The big chip: Challenge, model and architecture

Y Han, H Xu, M Lu, H Wang, J Huang, Y Wang… - Fundamental …, 2024 - Elsevier
Abstract As Moore's Law comes to an end, the implementation of high-performance chips
through transistor scaling has become increasingly challenging. To improve performance …

A 112-Gb/s—8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes

D Patel, A Sharif-Bakhtiar… - IEEE Journal of Solid …, 2022 - ieeexplore.ieee.org
A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect
transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude modulation (4 …

[HTML][HTML] High-bandwidth density silicon photonic resonators for energy-efficient optical interconnects

A Novick, A James, LY Dai, Z Wu, A Rizzo… - Applied Physics …, 2023 - pubs.aip.org
The growth of artificial intelligence applications demands ever larger and more complex
deep learning models, dominating today's—and tomorrow's—data center and high …

High capacity, low power, short reach integrated silicon photonic interconnects

A Netherton, M Dumont, Z Nelson, J Koo… - Photonics …, 2024 - opg.optica.org
The architecture and component technology of a low power, high capacity, short reach
optical interconnect are detailed. Measurements from high-performance 300 mm silicon …

Peta-scale embedded photonics architecture for distributed deep learning applications

Z Wu, LY Dai, A Novick, M Glick, Z Zhu… - Journal of Lightwave …, 2023 - ieeexplore.ieee.org
As Deep Learning (DL) models grow larger and more complex, training jobs are
increasingly distributed across multiple Computing Units (CU) such as GPUs and TPUs …

Highly integrated 4 Tbps silicon photonic IC for compute fabric connectivity

S Fathololoumi, C Malouin, D Hui… - … IEEE Symposium on …, 2022 - ieeexplore.ieee.org
In this work we present the design and performance of a high bandwidth, low power, low
latency, and high-density Silicon Photonic integrated circuit (SiPIC) for compute …