Electromigration effects in power grids characterized from a 65 nm test chip

C Zhou, R Fung, SJ Wen, R Wong… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
A 65 mn test chip to study electromigration (EM) events in integrated circuit power grids was
taped-out and successfully tested. A 9× 9 grid was implemented using M3 and M4 metal …

On-Chip Heater Design and Control Methodology for Reliability Testing Applications Requiring Over 300° C Local Temperatures

H Yu, YH Yi, N Pande, CH Kim - IEEE Transactions on Device …, 2023 - ieeexplore.ieee.org
This paper presents the design details and control methodologies for on-chip heaters that
can provide fast and accurate local temperature control for reliability testing applications …

System-level simulation of electromigration in a 3 nm cmos power delivery network: The effect of grid redundancy, metallization stack and standard-cell currents

H Zahedmanesh, I Ciofi, O Zografos… - 2022 IEEE …, 2022 - ieeexplore.ieee.org
A physics-based system-level electromigration (EM) modelling platform is employed to
simulate EM and its impact on the IR drop from the supply voltage to the standard-cells for a …

[HTML][HTML] Electromigration in Nano-Interconnects: Determining Reliability Margins in Redundant Mesh Networks Using a Scalable Physical–Statistical Hybrid Paradigm

H Zahedmanesh - Micromachines, 2024 - mdpi.com
This paper presents a hybrid modelling approach that combines physics-based
electromigration modelling (PEM) and statistical methods to evaluate the electromigration …

A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network

H Zahedmanesh, I Ciofi, O Zografos… - 2021 ACM/IEEE …, 2021 - ieeexplore.ieee.org
Electromigration has been a major reliability concern for nano-interconnects in CMOS
applications. With further CMOS miniaturization, the cross-sectional area of nano …

A pragmatic network-aware paradigm for system-level electromigration predictions at scale

H Zahedmanesh, P Roussel, I Ciofi… - 2023 IEEE International …, 2023 - ieeexplore.ieee.org
The standard approach for electro migration (EM) compliance checks of CMOS systems is
based on failure statistics from EM tests on single isolated interconnects. Thus, when …

Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis

YH Yi, C Kim, A Kteyan, A Volkov… - 2024 IEEE …, 2024 - ieeexplore.ieee.org
This work presents electromigration (EM) silicon data from realistic power grid device-under-
tests (DUT). Power grids featuring logic gate equivalent quasi-load cells were generated by …

[PDF][PDF] Contribution à la fiabilisation des interconnexions 3D dans le cadre du développement des capteurs photographiques

S Moreau - 2024 - cea.hal.science
Tout d'abord, je tiens à adresser mes plus vifs remerciements aux rapporteurs Alain
BRAVAIX, Roland FORTUNIER et Guillaume PARRY pour avoir consacré leur temps et leur …

Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters

YH Yi, C Kim, C Zhou, A Kteyan… - 2023 IEEE International …, 2023 - ieeexplore.ieee.org
This work presents statistical data collected from 38 power grid test structures showing the
detailed impact of temperature gradient on electro migration (EM) lifetime. The failure time …