Integrated optics in silicon and SiGe-heterostructures

B Schuppert, J Schmidtchen, A Splett… - Journal of lightwave …, 1996 - ieeexplore.ieee.org
This paper reviews various techniques and ideas in the field of integrated optics in silicon,
mainly focused on silicon in conjunction with germanium. We will discuss different …

Monolithic integration of multiwavelength compressive-strained multiquantum-well distributed-feedback laser array with star coupler and optical amplifiers

CE Zah, FJ Favire, B Pathak, R Bhat, C Caneau… - Electronics Letters, 1992 - infona.pl
The monolithic integration of a multiwavelength multiquantum-well distributed-feedback
(DFB) laser array with a star coupler and optical amplifiers on the same chip is reported. As …

Silica-based optical waveguide on terraced silicon substrate as hybrid integration platform

Y Yamada, A Takagi, I Ogawa, M Kawachi… - Electronics Letters, 1993 - infona.pl
Silica-based optical waveguide on terraced silicon substrate as hybrid integration platform ×
Close The Infona portal uses cookies, ie strings of text saved by a browser on the user's …

Coffin-Manson based fatigue analysis of underfilled DCAs

V Gektin, A Bar-Cohen… - IEEE Transactions on …, 1998 - ieeexplore.ieee.org
The continuing drive toward high-density, low-profile Integrated Circuit packaging has
accelerated the spread of flip-chip technology to laminated substrates, creating direct chip …

Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology

KH Hahn, RT Kaneshiro - US Patent 5,499,312, 1996 - Google Patents
A method and apparatus for automatic passive alignment of optical waveguides with
photonic devices to provide for high volume production of optical components at low cost …

Multichip optical hybrid integration technique with planar lightwave circuit platform

T Hashimoto, Y Nakasuga, Y Yamada… - Journal of lightwave …, 1998 - opg.optica.org
A two-step bonding technique for optical device assembly on a planar lightwave circuit
platform was developed, which consists of a chip-by-chip thermo-compression prebonding …

A micromachined pressure sensor with fiber-optic interferometric readout

MA Chan, SD Collins, RL Smith - Sensors and Actuators A: Physical, 1994 - Elsevier
A high sensitivity, batch fabricated, fiber-optic pressure sensor has been fabricated using
silicon micromachining technology. The transducer consists of a fiber positioning v-groove, a …

A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology

KP Jackson, EB Flint, MF Cina, D Lacey… - Journal of lightwave …, 1994 - ieeexplore.ieee.org
An optoelectronic transceiver module is described consisting of a four-channel AlGaAs
integrated laser/monitor transmitter and a four-channel GaAs MESFET integrated …

Diode-laser-to-waveguide butt coupling

P Karioja, D Howe - Applied optics, 1996 - opg.optica.org
A diode-laser-to-waveguide butt-coupling model is described. The model takes into
consideration the Fabry–Perot reflection and transmission of the étalon formed by the laser …

Gigabit transmitter array modules on silicon waferboard

CA Armiento, AJ Negri, MJ Tabasky… - IEEE transactions on …, 1992 - ieeexplore.ieee.org
Individually addressable, four-channel transmitter arrays operating at data rates of 1 Gb/s
have been developed based on a hybrid optoelectronic integration approach called silicon …