To reach large-scale quantum computing, three-dimensional integration of scalable qubit
arrays and their control electronics in multi-chip assemblies is promising. Within these …

We successfully study the warpage after wafer-to-wafer (W2W) bonding by the experiments
and the full wafer model simulation. Furthermore, the effect of the dicing process on the …

Direct wafer bonding technology has been widely used in the manufacturing of
microelectromechanical systems (MEMS). The chip deflection and strain energy can be …

Quantum computer chip based on spin qubits in diamond uses modules that are entangled
with on-chip optical links. This enables an increased connectivity and a negligible crosstalk …

Hydrophilic direct bonding of Nb-Nb fine pitch pads has been demonstrated for the first time.
Initially developed using full-sheet Nb layers, this process was successfully applied to bond …

Wafer warpage affects the resolution of photolithography, process alignment, and wafer
bonding, which leads to the degradation of the device's yield, performance, and reliability …

Wafer warpage occurs during the fabrication process, which induces many issues such as
wafer handling, lithography alignment, device reliability. The efficiency of dicing street on …

As the number of qubits goes beyond one million, the I/O count and the interconnect wiring
within a limited area become problematic. In this paper, we present a simple integration …

Quantum computing relies on a blend of superposition and entanglement phenomena of
qubit devices to solve problems. It promises unparalleled computational throughput that has …

Fabrication of more and more complex multichip assemblies with quantum devices and
quantum bits is driving efforts toward superconducting interconnect developments. In this …