M Li, W Ding, B Li, J Xu - Ceramics International, 2019 - Elsevier
Dressing experiments under different conditions were carried out on a vitrified bonded microcrystal alumina abrasive wheel with a single-grit diamond dresser. The grinding …
M Li, W Ding, Z Zhao, C Dai, J Xu - Journal of Manufacturing Processes, 2020 - Elsevier
In order to better understand the dressing behavior, an investigation was carried out to detect the contact zone between vitrified bonded cubic boron nitride (V-CBN) abrasive …
The grinder consults measurement modules to control the endpoint thickness of the sapphire wafer thinning process, but these modules have shortcomings. We propose a …
In order to promoting the optimization of the theme:“grinding-dressing”, this study intends to contribute to the fill the gap of works completed with the damage diagnostic systems in …
Grinding is a finish process of parts that require high precision and tight dimensional tolerance, which owe high value-added. As the grinding process takes place, the cutting …
XT Xiao, Z Liang, L Zhang, S Tang - Measurement, 2021 - Elsevier
Eddy current pulse thermography (ECPT) is an active thermography technology in the nondestructive testing field. The inductor of ECPT is an important component that influences …
The thinning of sapphire wafers is a key process that affects the quality of optoelectronic devices. In the grinding process for sapphire, a hard and brittle material, the grade and …
O processo de manufatura aditiva por fusão e deposição (FDM–Fused Deposition Modeling), também conhecido como processo de impressão 3D, trata da fabricação de …
The pencil lead break method (PLB) is widely used on account of its efficiency in the characterization of acoustic emission sensors (AE), which are used in the monitoring of …