BACKGROUND Packaging Solutions continue to evolve to meet the increas ingly stringent
design constraints imposed by electronic devices and systems with ever higher integrated …

An integrated circuit package includes a balanced-part struc ture. The condition of thermal
stress of chips connected on a Substrate decides the amount, locations, weights, and the …

A method for fabricating a semiconductor device heat spreader from a unitary piece of
metallic material. The metallic material is stamped to form a unitary heat spreader having an …

A semiconductor package may include a substrate, and a semiconductor interposer having
a cavity and a plurality of through semiconductor vias. The semiconductor interposer is …

(57) ABSTRACT A three dimensional integrated circuit (3DIC) includes a first Substrate and
a heat spreading structure embedded in the first substrate. The 3DIC further includes a die …

The present application discloses various implementations of a semiconductor package
including an organic Substrate and one or more interposers having through-semiconductor …

BACKGROUND To interface bare semiconductor dies to a Support Surface Such as a
printed circuit board, there is a need for an appro priate package substrate or interposer to …

A novel thermal bus is shown that more effectively transmits heat away from a die of an IC.
The innovative thermal bus is capable of transmitting heat to other heat dissipating devices …

A method and apparatus for cooling an integrated circuit die. An integrated circuit package
comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit …

A heat spreader for electrical device is disclosed, a portion of said heat spreader is above
and corresponding to a chip which is coupled with a base of electrical device. An …