A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs)

SS Salvi, A Jain - IEEE Transactions on Components …, 2021 - ieeexplore.ieee.org
Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

Monolithic 3D neuromorphic computing system with hybrid CMOS and memristor-based synapses and neurons

H An, MA Ehsan, Z Zhou, F Shen, Y Yi - Integration, 2019 - Elsevier
Because of fabrication compatibility to current semiconductor technology, three-dimensional
integrated circuits (3D-ICs) offer promising near-term solutions for maintaining Moore's Law …

3D stackable synaptic transistor for 3D integrated artificial neural networks

SK Kim, YJ Jeong, P Bidenko, HR Lim… - … applied materials & …, 2020 - ACS Publications
Although they have attracted enormous attention in recent years, software-based and two-
dimensional hardware-based artificial neural networks (ANNs) may consume a great deal of …

Three dimensional integrated circuit

I Michael - US Patent 9,704,835, 2017 - Google Patents
A method comprises providing a first substrate having dielectric structures and conductive
structures. Ions are implanted into the first substrate, the ions traveling through the dielectric …

Electrical coupling of monolithic 3-D inverters

YS Yu, S Panth, SK Lim - IEEE Transactions on Electron …, 2016 - ieeexplore.ieee.org
In this brief, we investigate the electrical coupling between stacked field-effect transistors
(FETs) in monolithic 3-D inverters (M3INVs). We study the range of interlayer dielectric (ILD) …

High performance and low power monolithic three-dimensional sub-50 nm poly Si thin film transistor (TFTs) circuits

TT Wu, WH Huang, CC Yang, HC Chen, TY Hsieh… - Scientific Reports, 2017 - nature.com
Abstract Development of manufacture trend for TFTs technologies has focused on improving
electrical properties of films with the cost reduction to achieve commercialization. To achieve …

Fault Diagnosis for Resistive Random Access Memory and Monolithic Inter-Tier Vias in Monolithic 3-D Integration

SC Hung, A Chaudhuri, S Banerjee… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Resistive random access memory (RRAM) constitutes a promising technology for next-
generation memory architectures due to its simple structure, high on/off ratio, and processing …

Modeling and Design of Dual-purpose MIV in Monolithic 3D IC

MS Vemuri, UR Tida - IEEE Access, 2024 - ieeexplore.ieee.org
Transistor-level monolithic three-dimensional integrated circuit (M3D-IC) technology
potential is compromised with the silicon footprint overhead caused by metal inter-layer via …

Transistor-level camouflaged logic locking method for monolithic 3D IC security

J Dofe, C Yan, S Kontak, E Salman… - 2016 IEEE Asian …, 2016 - ieeexplore.ieee.org
This work proposes a novel method for transistor-level logic locking to address intellectual
property (IP) piracy and reverse engineering attacks in monolithic three-dimensional (M3D) …

Investigation of monolithic 3D integrated circuit inverter with feedback field effect transistors using TCAD simulation

JH Oh, YS Yu - Micromachines, 2020 - mdpi.com
The optimal structure and process for the feedback field-effect transistor (FBFET) to operate
as a logic device are investigated by using a technology computer-aided design mixed …