In recent years, in order to adapt to the trend of low-temperature assembly and integration,
low-temperature hybrid solders with multiple elements added to the tin solder matrix have …

The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of
Sn–3.7 Ag–0.7 Cu; Sn–1.0 Ag–0.5 Cu–1.0 Bi and Sn–1.5 Ag–0.7 Cu–9.5 In (composition …

The preparation of new solder joint materials for chip packaging by designing a variety of
brazing material mixes has become one of the future research directions for solder joints …

Interfacial reactions and joint reliability of Sn-3.0 Ag-0.5 Cu solder with two different surface
finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless …

Abstract In this study, Ni-Cu/SAC composite solders with different Cu contents were used as
an interlayer to solder Al alloy joints at 250℃ for different time. The results showed that the …

Due to safety and reliability concerns, various classes and/or applications of electronic
products are excluded from the European Union's Restriction of Hazardous Substances …

This paper investigates the impact of isothermal aging on the long-term reliability of lead-
free solder joints. The full experimental matrix contains SAC105 and SAC305 solder alloys …

The paper presents new results concerning the influence of nickel addition (1 and 5 at.%)
into tin on the development of the Cu/(Sn, Ni) interface area in diffusion couple experiment …

The demand for flexible wearable devices/substrates with miniaturization and improved
integration in microelectronic devices has intensified the research interest in low …

Electronic components of the spacecraft during their service may endure intricate and
extreme temperature environments. In this study, the interfacial microstructure evolution and …