Two-side laser processing method for producing high aspect ratio microholes
V Nasrollahi, P Penchev… - Journal of Micro …, 2017 - asmedigitalcollection.asme.org
Laser microprocessing is a very attractive option for a growing number of industrial
applications due to its intrinsic characteristics, such as high flexibility and process control …
applications due to its intrinsic characteristics, such as high flexibility and process control …
[HTML][HTML] Micro-drilling of silicon wafer by industrial CO2 laser
Laser micromachining is currently used in the MEMS production to replace the traditional
etching process which consumes longer time to complete. The objective of this study is to …
etching process which consumes longer time to complete. The objective of this study is to …
Numerical analysis of guided wave transmission through a long defect in a rail track
PW Loveday, CS Long - Journal of …, 2022 - asmedigitalcollection.asme.org
Guided wave ultrasound has been used to continuously monitor welded rail track by
transmitting guided wave ultrasound between alternate transmit and receive stations along …
transmitting guided wave ultrasound between alternate transmit and receive stations along …
[PDF][PDF] Two-Side Laser Processing Method for Producing High Aspect Ratio Microholes
Laser microprocessing is a very attractive option for a growing number of industrial
applications due to its intrinsic characteristics, such as high flexibility and process control …
applications due to its intrinsic characteristics, such as high flexibility and process control …