This paper reviews sintered silver (s-Ag) die-attach materials for wide band gap (WBG)
semiconductor packaging. WBG devices that die-attach with s-Ag have attracted a lot of …

The employment of sintered silver (SAG) as die attach material is one of the most promising
solutions to utilize the advantages of wide bandgap semiconductors in modern power …

This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for
silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of …

This article investigates the degradation mechanism of sintered silver (s-Ag) layer in silicon
carbide (SiC) die attach by means of thermal shocked test (TST) and nine-point bending test …

This work presents an integrated experimental–numerical method to characterize, model,
and experimentally study the properties of transfer molded power modules, considering two …

This paper compares the degradation of sintered silver (s-Ag) die attach between a thermal
shock test (TST) and a mechanical cycling test to correctly understand the mechanism of s …

This article investigates the mechanism of brittle-ductile deformation and fracture for sintered
silver (s-Ag) film by means of in situ scanning electron microscopy (SEM) uniaxial tensile …

A “sandwich” MD model composed of silver nanoparticles (AgNPs) and SiC/Cu plates was
constructed to examine the interconnection quality of interfaces between nanoparticles and …

To preserve the structural integrity of power semiconductor devices, ensuring a reliable
connection between wide-bandgap (WBG) chips and their substrates at temperatures above …

Computational modeling for manufacturing is a promising candidate for accelerating the
development of devices consisting of compressed sintered powders. Understanding the …