RF MEMS inductors and their applications—A review

OF Hikmat, MSM Ali - Journal of Microelectromechanical …, 2016 - ieeexplore.ieee.org
Inductors are primary elements in many radio frequency circuitries and devices. This review
gives a comprehensive survey on the developments and performances of fixed and variable …

Bandpass-filtering power amplifier with compact size and wideband harmonic suppression

T Feng, K Ma, Y Wang, J Hu - IEEE Transactions on Microwave …, 2021 - ieeexplore.ieee.org
This article proposed a codesign of a power amplifier (PA) and a bandpass filter (BPF)
named filtering PA using metal integrated and substrate integrated suspended line (MI …

Micro‐fabricated bandpass filter using intertwined spiral inductor and interdigital capacitor

Z Chuluunbaatar, KK Adhikari, C Wang… - Electronics …, 2014 - Wiley Online Library
A bandpass filter (BPF) with a central frequency of 2.31 GHz for future worldwide
interoperability for microwave access (WiMax) applications using integrated passive device …

Design and realization of a compact high-frequency band-pass filter with low insertion loss based on a combination of a circular-shaped spiral inductor, spiral …

KH Lee, ES Kim, JG Liang, NY Kim - Electronics, 2018 - mdpi.com
In this study, the proposed bandpass filter (BPF) connects an interdigital and a spiral
capacitor in series between the two symmetrical halves of a circular intertwined spiral …

Micromachined passive bandpass filters based on GaAs monolithic-microwave-integrated-circuit technology

Z Zhang, X Liao - IEEE transactions on electron devices, 2012 - ieeexplore.ieee.org
This paper presents micromachined on-chip RF passive bandpass filters at 1-8 GHz based
on utilizing a three-pole LC low-pass filter and two dc-blocking capacitors, which is …

Thick-copper-buried inductors using anodized aluminum package substrates

CH Kim, YS Kwon - IEEE Transactions on Components …, 2012 - ieeexplore.ieee.org
Spiral inductors were fabricated by burying thick metals in radio frequency (RF) package
substrates. The inductors consist of a 40-μm-thick copper spiral buried in an anodized …

New selective two-step anodization of porous anodic alumina for thin-film encapsulation

GJ Jeon, WY Kim, HC Lee - Microelectronic engineering, 2013 - Elsevier
In this paper, we propose a new selective two-step method of anodization of porous anodic
alumina (PAA) for thin-film encapsulation. It is based on the formation of a selectively …

High performance suspended spiral inductor and band-pass filter by wafer level packaging technology

T Zheng, G Xu, L Luo - Microsystem Technologies, 2017 - Springer
Suspended inductors and 2.45 GHz BPF with patterned ground shields on the lossy silicon
substrate by using Cu/BCB based wafer level packaging and bulk Si etching technologies …

High performance 3D glass-embedded inductors fabricated by a glass reflow process

MA Zhang, J Shang, B Luo - 2016 IEEE 66th Electronic …, 2016 - ieeexplore.ieee.org
Inductor is a key passive component in radio-frequency integrated circuits (RFICs).
Compared with other components in the circuit, inductor has a bigger size, hence its …

A miniaturized 2.5 GHz 8 W GaN HEMT power amplifier module using selectively anodized aluminum oxide substrate

HC Jeong, KW Yeom - IEICE transactions on electronics, 2012 - search.ieice.org
In this paper, the design and fabrication of a miniaturized class-F 2.5 GHz 8 W power
amplifier using a commercially available GaN HEMT bare chip from TriQuint and a …