11 FIG. 8 provides another embodiment of the multibeam filamentation scribing method
(shown initially in FIG. 4) for processing double or multiple stacked or layer transparent …

A method for the laser-based machining of a sheet-like substrate, in order to separate the
substrate into multiple portions, in which the laser beam of a laser for machining the …

The present invention relates to a laser cutting technology for cutting and separating thin
substrates of transparent materials, for example to cutting of display glass compositions …

Systems and methods are described for forming continuous laser filaments in transparent
materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed …

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent
brittle parts from substrates with particular interest in substrates formed from strengthened or …

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary
shape using lasers are described herein. Three general methods to produce chamfers on …

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal
line oriented along the beam propagation direction and directed into the material, the laser …

The present invention relates to a method for producing a contour in a planar substrate and
for separating the contour from the substrate, in particular for producing an internal contour …

A method for machining and releasing closed forms from a transparent, brittle substrate
includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate …

A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is
disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at …