As the miniaturization of electronic devices continues and the heat flux increases rapidly,
thermal management techniques are facing serious challenges. Microchannel heat sinks …

Recent advancement in the micro-scale and nano-scale electronics systems, the demand of
an innovative solution for the thermal management to dissipate the high amount of heat flux …

In an effort to reduce the highest temperature of electronic pieces, using high performance
cooling systems is required, and for this reason, optimization is one of the most essential …

Enhanced heat transfer technology can be divided into active technology and passive
technology based on whether external power is consumed. Due to the absence of external …

In this work, we propose a new design concept of microchannel heat sink, in which solid fins
are replaced by porous fins, to reduce the pressure drop across the heat sink. The …

The method to cool a high heat flux device is an important research direction for the heat
exchanger design. Micro-channels are an effective heat exchange structure both for single …

With the rapid development of computer chips with high heat flux, efficient chip cooling is
becoming crucial. In this study, a finned water-cooled radiator is developed and its …

A new design of wavy microchannel heat sink with porous fins is proposed to reduce
simultaneously pressure drop and thermal resistance. A three-dimensional solid-fluid …

The present trend of miniaturization in various electronic devices has caused higher heat
generation per unit area. Dissipation of highly concentrated heat from these devices is …

Microchannel heat sinks have provided an efficient solution in the thermal management of
high-power density devices. In general, however, they cannot exhibit high thermal …