III–V/Ge channel MOS device technologies in nano CMOS era

S Takagi, R Zhang, J Suh, SH Kim… - Japanese Journal of …, 2015 - iopscience.iop.org
CMOS utilizing high-mobility III–V/Ge channels on Si substrates is expected to be one of the
promising devices for high-performance and low power advanced LSIs in the future …

Surface passivation of germanium by atomic layer deposited Al2O3 nanolayers

WJH Berghuis, J Melskens, B Macco… - Journal of Materials …, 2021 - Springer
Surfaces of semiconductors are notorious for the presence of electronic defects such that
passivation approaches are required for optimal performance of (opto) electronic devices …

Excellent surface passivation of germanium by a-Si: H/Al2O3 stacks

WJH Berghuis, J Melskens, B Macco… - Journal of Applied …, 2021 - pubs.aip.org
Surface passivation of germanium is vital for optimal performance of Ge based
optoelectronic devices especially considering their rapidly increasing surface-to-volume …

III-V/Ge MOS device technologies for low power integrated systems

S Takagi, M Noguchi, M Kim, SH Kim, CY Chang… - Solid-State …, 2016 - Elsevier
CMOS utilizing high mobility III-V/Ge channels on Si substrates is expected to be one of the
promising devices for high performance and low power integrated systems in the future …

Slow Trap Properties and Generation in Al2O3/GeOx/Ge MOS Interfaces Formed by Plasma Oxidation Process

M Ke, M Takenaka, S Takagi - ACS Applied Electronic Materials, 2019 - ACS Publications
For realizing Ge CMOS devices with a small equivalent oxide thickness (EOT) and a low
density of fast interface states (D it), understanding of slow traps in Ge gate stacks and …

Physical Origins of High Normal Field Mobility Degradation in Ge p- and n-MOSFETs With GeOx/Ge MOS Interfaces Fabricated by Plasma Postoxidation

R Zhang, X Yu, M Takenaka… - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
Mechanisms of the mobility degradation in high normal field (or N) in Ge p-and n-metal-
oxide–semiconductor field-effect transistors (MOSFETs) with plasma postoxidation GeO …

Properties of slow traps of ALD Al2O3/GeOx/Ge nMOSFETs with plasma post oxidation

M Ke, X Yu, C Chang, M Takenaka, S Takagi - Applied Physics Letters, 2016 - pubs.aip.org
The realization of Ge gate stacks with a small amount of slow trap density as well as thin
equivalent oxide thickness and low interface state density (D it) is a crucial issue for Ge …

Impact of back interface passivation on electrical properties of ultrathin-body Germanium-on-insulator (GeOI) MOSFETs

X Yu, J Kang, R Zhang, WL Cai, M Takenaka… - Microelectronic …, 2015 - Elsevier
High mobility ultrathin-body GeOI MOSFETs with improved interfacial quality of the buried
oxide interfaces are demonstrated in this study. We have realized these devices by flipping …

Fabrication and MOS interface properties of ALD AlYO3/GeOx/Ge gate stacks with plasma post oxidation

M Ke, X Yu, R Zhang, J Kang, C Chang… - Microelectronic …, 2015 - Elsevier
The realization of Ge gate stacks with thin equivalent oxide thickness (EOT), low interface
state density (D it) and small hysteresis is a crucial issue for Ge CMOS. In this study, we …

Impact of Atomic Layer Deposition High k Films on Slow Trap Density in Ge MOS Interfaces With GeOx Interfacial Layers Formed by Plasma Pre-Oxidation

M Ke, M Takenaka, S Takagi - IEEE Journal of the Electron …, 2018 - ieeexplore.ieee.org
For realizing of Ge complementary metal-oxide-semiconductor with a Ge gate stack with thin
equivalent oxide thickness, low interface state density (D it) and high reliability. In this paper …