Chip-based photonic graph states

J Huang, X Chen, X Li, J Wang - AAPPS Bulletin, 2023 - Springer
Graph states are one of the most significant classes of entangled states, serving as the
quantum resources for quantum technologies. Recently, integrated quantum photonics is …

Hybrid integration of chipscale photonic devices using accurate transfer printing methods

JA Smith, D Jevtics, B Guilhabert, MD Dawson… - Applied Physics …, 2022 - pubs.aip.org
Transfer printing is becoming widely adopted as a back-end process for the hybrid
integration of photonic and electronic devices. Integration of membrane components, with …

On-chip optical comb sources

A Hermans, K Van Gasse, B Kuyken - APL Photonics, 2022 - pubs.aip.org
On-chip integration of optical comb sources is crucial in enabling their widespread use.
Integrated photonic devices that can be mass-manufactured in semiconductor processing …

[HTML][HTML] High-pulse-energy III-V-on-silicon-nitride mode-locked laser

A Hermans, K Van Gasse, JØ Kjellman, C Caër… - APL Photonics, 2021 - pubs.aip.org
Mode-locked lasers find their use in a large number of applications, for instance, in
spectroscopic sensing, distance measurements, and optical communication. To enable …

Wafer-scale hybrid integration of InP DFB lasers on Si photonics by flip-chip bonding with sub-300 nm alignment precision

A Marinins, S Hänsch, H Sar… - IEEE Journal of …, 2022 - ieeexplore.ieee.org
InP DFB lasers are flip-chip bonded to 300 mm Si photonic wafers using a pick-and-place
tool with an advanced vision system, realizing high-precision and high-throughput passive …

Integration of edge-emitting quantum dot lasers with different waveguide platforms using micro-transfer printing

A Uzun, FB Atar, S Iadanza, R Loi… - IEEE Journal of …, 2023 - ieeexplore.ieee.org
O-band InAs/GaAs Quantum Dot edge-emitting lasers are integrated onto a number of
waveguiding platforms using micro-transfer printing. These are deep recesses in 220 nm Si …

Transferrable AlGaN/GaN high-electron mobility transistors to arbitrary substrates via a two-dimensional boron nitride release layer

MJ Motala, EW Blanton, A Hilton, E Heller… - … applied materials & …, 2020 - ACS Publications
Mechanical transfer of high-performing thin-film devices onto arbitrary substrates represents
an exciting opportunity to improve device performance, explore nontraditional manufacturing …

Transfer printing micro-assembly of silicon photonic crystal cavity arrays: Beating the fabrication tolerance limit

SP Bommer, C Panuski, B Guilhabert, Z Xia… - arXiv preprint arXiv …, 2024 - arxiv.org
Photonic crystal cavities (PhCCs) can confine optical fields in ultra-small volumes, enabling
efficient light-matter interactions for quantum and non-linear optics, sensing and all-optical …

Integration of High-Performance InGaAs/GaN Photodetectors by Direct Bonding via Micro-transfer Printing

Y Liu, Z Li, FB Atar, H Muthuganesan… - … Applied Materials & …, 2024 - ACS Publications
The integration of dissimilar semiconductor materials holds immense potential for
harnessing their complementary properties in novel applications. However, achieving such …

Thermal characterisation of hybrid, flip-chip inp-si dfb lasers

D Coenen, H Sar, H Oprins, A Marinins, Y De Koninck… - Micromachines, 2023 - mdpi.com
WA detailed thermal analysis of a hybrid, flip-chip InP-Si DFB laser is presented in this work.
The lasers were experimentally tested at different operating temperatures, which allowed for …