Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5 Cu solder joints under extreme temperature thermal shock
R Tian, C Hang, Y Tian, L Zhao - Materials Science and Engineering: A, 2018 - Elsevier
The microstructure evolution and growth mechanism of interfacial intermetallic compounds
(IMCs) as well as the mechanism for early formation of cracks in Sn-3Ag-0.5 Cu solder joints …
(IMCs) as well as the mechanism for early formation of cracks in Sn-3Ag-0.5 Cu solder joints …
Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution
Q Li, W Zhao, W Zhang, W Chen, Z Liu - International Journal of Fatigue, 2023 - Elsevier
Abstract SAC305 (Sn-3.0% Ag-0.5% Cu) BGA (ball grid array) solder joints were subjected
to thermal cycling. As the number of thermal cycles increased, the thickness of IMCs …
to thermal cycling. As the number of thermal cycles increased, the thickness of IMCs …
Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging
Trace amount of rare earth Ce (0.03 wt.%) was added into SnAgCu solder in order to reform
the properties of the solder. In this study, interface reaction mechanism during thermal …
the properties of the solder. In this study, interface reaction mechanism during thermal …
Effects of indium addition on properties and wettability of Sn–0.7 Cu–0.2 Ni lead-free solders
LF Li, YK Cheng, GL Xu, EZ Wang, ZH Zhang… - Materials & Design, 2014 - Elsevier
This paper reports the investigation on indium addition into Sn–0.7 Cu–0.2 Ni lead-free
solder to improve its various performances. The effects of indium addition on melting …
solder to improve its various performances. The effects of indium addition on melting …
Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints
JX Wang, SB Xue, ZJ Han, SL Yu, Y Chen… - Journal of Alloys and …, 2009 - Elsevier
In order to improve the properties of Sn–3.8 Ag–0.7 Cu and Sn–0.5 Cu–0.05 Ni solders, 0–
0.1 wt.% of rare earth Ce was added to the base alloys, and the microstructures were …
0.1 wt.% of rare earth Ce was added to the base alloys, and the microstructures were …
First-principles investigation of the structural and electronic properties of Cu6− xNixSn5 (x= 0, 1, 2) intermetallic compounds
C Yu, J Liu, H Lu, P Li, J Chen - Intermetallics, 2007 - Elsevier
Cu6− xNixSn5 is an important intermetallic compound (IMC), which was known to greatly
improve the reliability of the solder joints in integrated circuits. However, the improvement …
improve the reliability of the solder joints in integrated circuits. However, the improvement …
Microstructure, interfacial IMC and mechanical properties of Sn–0.7 Cu–xAl (x= 0–0.075) lead-free solder alloy
L Yang, Y Zhang, J Dai, Y Jing, J Ge, N Zhang - Materials & Design, 2015 - Elsevier
The effect of aluminum concentration on the microstructure, wettability, interfacial IMC and
mechanical properties of Sn–0.7 Cu lead-free solder alloy is investigated. The results show …
mechanical properties of Sn–0.7 Cu lead-free solder alloy is investigated. The results show …
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
MAA Mohd Salleh, SD McDonald, CM Gourlay… - Journal of Electronic …, 2016 - Springer
This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu
6 Sn 5 in Sn-0.7 wt.% Cu solder paste soldered on a Cu substrate, using a real-time …
6 Sn 5 in Sn-0.7 wt.% Cu solder paste soldered on a Cu substrate, using a real-time …
Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-xBi/Cu joints
SA Belyakov, JW Xian, K Sweatman… - Journal of Alloys and …, 2017 - Elsevier
The improvement of solder joint mechanical performance due to bismuth additions is of
ongoing interest. This paper investigates the influence of 0–14 wt% Bi on microstructure …
ongoing interest. This paper investigates the influence of 0–14 wt% Bi on microstructure …