Interfacial reaction issues for lead-free electronic solders
The interfacial reactions between Sn-based solders and two common substrate materials,
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8 Ag–0.7 Cu lead-free solder and copper substrate
This paper reports on the effects of adding Ni nanoparticles to a Sn–3.8 Ag–0.7 Cu solder.
The nanocomposite was prepared by manual blending of SAC solder paste with various …
The nanocomposite was prepared by manual blending of SAC solder paste with various …
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
W Peng, E Monlevade, ME Marques - Microelectronics Reliability, 2007 - Elsevier
Interfacial structure plays a great role in solder joint reliability. In solder joints on Cu, not only
is Kirkendall voiding at the solder/Cu interface a concern, but also the growth of interfacial …
is Kirkendall voiding at the solder/Cu interface a concern, but also the growth of interfacial …
First-principles investigation of the structural and electronic properties of Cu6− xNixSn5 (x= 0, 1, 2) intermetallic compounds
C Yu, J Liu, H Lu, P Li, J Chen - Intermetallics, 2007 - Elsevier
Cu6− xNixSn5 is an important intermetallic compound (IMC), which was known to greatly
improve the reliability of the solder joints in integrated circuits. However, the improvement …
improve the reliability of the solder joints in integrated circuits. However, the improvement …
Temperature effect on intermetallic compound growth kinetics of Cu pillar/Sn bumps
The in situ intermetallic compound (IMC) growth in Cu pillar/Sn bumps was investigated by
isothermal annealing at 120° C, 150° C, and 180° C using an in situ scanning electron …
isothermal annealing at 120° C, 150° C, and 180° C using an in situ scanning electron …
Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn3. 0Ag0. 5CuxTiO2 solder joints
Y Tang, SM Luo, KQ Wang, GY Li - Journal of Alloys and compounds, 2016 - Elsevier
In this study, the effect of nano-TiO 2 particles additive on the growth of interfacial Cu 6 Sn 5
and Cu 3 Sn intermetallic compound (IMC) layers between Snsingle bond3. 0Agsingle …
and Cu 3 Sn intermetallic compound (IMC) layers between Snsingle bond3. 0Agsingle …
IMC growth and shear strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA joints during aging
The realization of harmful effects of Pb on the environment and human health, coupled with
the threat of legislation, has instigated a search for electronic packaging applications using …
the threat of legislation, has instigated a search for electronic packaging applications using …
Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints
F Khodabakhshi, I Wodak, A Yakymovych… - Materials …, 2024 - Elsevier
Hybrid solder joints with upgraded functional performance and reliability were processed by
applying reactive Fe-nanoparticles doped into the flux at the interface in order to control and …
applying reactive Fe-nanoparticles doped into the flux at the interface in order to control and …
Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization
The morphological and compositional evolutions of intermetallic compounds (IMCs) formed
at three Pb-free solder/electroless Ni-P interface were investigated with respect to the solder …
at three Pb-free solder/electroless Ni-P interface were investigated with respect to the solder …
Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5 Ag-0.75 Cu solder and Cu substrate
Intermetallic compound (IMC) growth during solid-state isothermal aging at temperatures
between 100 and 200° C up to 60 days for Sn-3.5 Ag-0.75 Cu solder on Cu substrate was …
between 100 and 200° C up to 60 days for Sn-3.5 Ag-0.75 Cu solder on Cu substrate was …