Micro-and nanoelectromechanical systems have numerous applications in sensing and
signal transduction. Many properties benefit from reducing the system size to the nanoscale …

2008/0314147 A1 12/2008 Nasiri et al. 7,051,590 B1 5, 2006 Lemkin et al. 2009 OO64780
A1 3/2009 Coronato et al. 7,093,487 B2 8/2006 Mochida 2009/0140606 A1 6/2009 Huang …

One example includes an integrated circuit including at least one electrical interconnects
disposed on an elongate are extending away from a main portion of the integrated circuit …

This document discusses, among other things, an inertial measurement system including a
device layer including a single proof-mass 3-axis accelerometer, a cap wafer bonded to a …

GOIP 15/097(2006.01) 7,595,648 B2 9/2009 Ungaretti et al. 7,600,428 B2 10/2009 Robert et
al.(56) References Cited 7,616,078 B2 11/2009 Prandi et al. 7,622,782 B2 11/2009 Chu et …

5,487.305 A 1/1996 Ristic et al. portion configure to rotate about a first axis using a first
hinge, 5,491,604 A 2/1996 Nguyen et al. the first axis parallel to an xy plane orthogonal to a …

One example includes an integrated circuit including at least one electrical interconnects
disposed on an elongate are extending away from a main portion of the integrated circuit …

Micromachined devices and methods for making the devices. The device includes: a first
wafer having at least one via; and a second wafer having a micro-electromechanical …

6 351996 B1 3, 2002 Nasiri et al. 2006.0034472 A1 2/2006 Bazarjani et al. 6,366,468 B1
4/2002 Pan 2006/0043608 A1 3/2006 Bernier et al. 6,390.905 Bi 52002 Korovin et al …

An apparatus includes a capacitance-to-voltage converter cir cuit configured to be
electrically coupled to a micro-electro mechanical system (MEMS) sensor circuit. The …