With the rapid development of electronical products, many primary challenges arise in the
field of design and manufacture, among which the property of electronical packaging …

In recent years, in order to adapt to the trend of low-temperature assembly and integration,
low-temperature hybrid solders with multiple elements added to the tin solder matrix have …

In this investigation, ultrasonic-assisted soldering at 260° C in air produced high strength
and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite …

The self-healing of Kirkendall voids (KVs) was observed on the interface between Sn and (1
1 1) oriented and nanotwinned Copper ((1 1 1) nt-Cu) during aging. Around 85% of KVs …

Recently, research into the factors that influence the formation and growth of intermetallic
compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important …

The preparation of new solder joint materials for chip packaging by designing a variety of
brazing material mixes has become one of the future research directions for solder joints …

The effects of Ni (P) layer thickness (5 μm and 0.7 μm) on the microstructural behavior and
electrical reliability of electroless-nickel electroless-palladium immersion gold …

With the development of the fine pitch technology, the size of the solder bumps contacting
the chip and the substrate has decreased, thereby significantly increasing the current …

The microstructure and phase composition of Ni-P and Ni-P-Re layers with medium
phosphorus content of 8.8 and 8.2 wt.% of P, respectively, and 6.8 wt.% of Re electroless …

Interfacial reactions and intermetallic compound (IMC) formation of Sn–1 wt.% Ag solder
with two different surface finishes, electroless nickel–immersion gold (ENIG) and electroless …