In this review, we discuss the progress of emerging dry processes for nanoscale fabrication.
Experts in the fields of plasma processing have contributed to addressing the increasingly …

Abstract Background Cu-Cu direct bonding is a promising technology to construct a
temperature resistant bonding structure for emerging power devices and vehicle electronics …

High-density electronics are hindered by the constraints of Sn-based solder joints,
necessitating the exploration of Cu–Cu solid-state bonding. However, current bonding …

Purpose This paper aims to examine the effects of bonding temperature, bonding time,
bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P …

Cu/dielectric hybrid bonding at low temperatures of no more than 200 C remains
challenging because of the different features of Cu-Cu and dielectric-dielectric (such as SiO …

Formic acid, which can provide efficient reduction for most solders, is widely used in fluxless
soldering. In this study, to establish a reliable fluxless soldering process, a formic acid …

Binary TiO2/SiO2 oxides were synthesized via flame spray pyrolysis as supports for a Pt
catalyst. The effect of the mole ratio of the silica on the catalyst characteristics and catalytic …

This study investigated low temperature reduction of copper oxides using modified formic
acid vapor treatment with Pt catalysts in terms of reaction kinetics and mechanisms. An in …

Soldering is a dominating process for semiconductor packaging. For electronic
manufacturing tin based solders play a key role. The surface of most solder alloys is …

With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at
an ultra-low temperature of 160° C under 3 MPa for 30 min via the sintering of Ag …