In this paper, electrical characteristic analysis and corresponding experimental tests on gold
bonding wire are presented. Firstly, according to EIA (Electronic Industries …

The invention of 14 C-based solid state diamond power-cells offers unique opportunities for
demonstrating a circular economy in relation to fissile energy production; and closed-loop …

Classified information may be derivable from unintended electromagnetic signals. This
article presents a technical analysis of LED arrays used in monochrome computer printers …

Shear testing of wire bonds in microelectronics devices is important in bonding process
qualification, but the actual mechanism of shearing Cu bonds from Al pads is not thoroughly …

Electronics have contributed to the advancement of healthcare, wellness, security, and
mobility, resulting in a higher standard of living. However, these ever‐accelerating …

Copper has been widely adopted as a viable alternative to gold for wire bonding, due to its
lower cost, better electrical and thermal conductivity, lower tendency for wire sweep due to a …

As the prevalence of electronics increases and their lifespan decreases, the volume of
electronic waste (E-waste) continues to grow. Recycling E-waste poses challenges due to …

Wide bandgap semiconductors, such as silicon carbide (SiC), have properties that allow
them to surpass the performance of conventional silicon (Si) semiconductors in power …

Wire bonding remains one of the most widely adopted interconnection techniques in the
field of electronic packaging. At present, the most effective way to ensure a long life and high …

Copper (Cu) wire bond is used in a majority of microelectronic devices but has not been fully
accepted by all industries due to potential reliability issues. Good quality bond is believed to …