A novel package-integrated cyclone cooler for the thermal management of power electronics
In order for electronics packaging power density to increase, innovations and improvements
in heat transfer are required. Electrification of transportation has the potential for significant …
in heat transfer are required. Electrification of transportation has the potential for significant …
Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
M Guerrero, P Quintero… - International …, 2021 - asmedigitalcollection.asme.org
Ceramic substrates for electronic packaging of high-power applications are growing in
demand due to their robustness as power and thermal requirements increase. Aluminum …
demand due to their robustness as power and thermal requirements increase. Aluminum …