Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …

We review the current state-of-the-art graphene-enhanced thermal interface materials for the
management of heat in the next generation of electronics. Increased integration densities …

Modern microelectronics and emerging technologies such as wearable devices and soft
robotics require conformable and thermally conductive thermal interface materials to …

Thermal interface materials (TIMs) with high thermal conductivity, fluidic characteristics, and
surface wettability are crucial for the effective thermal management of high-power …

Using thermal interface materials (TIMs) is generally considered an effective way to reduce
thermal contact resistance. In this paper, effects of surface roughness, temperature and …

Conventional thermal interface materials (TIMs) as widely used in thermal management
area is inherently limited by their relatively low thermal conductivity. From an alternative, the …

Room-temperature liquid metals (LMs) are attractive candidates for thermal interface
materials (TIMs) because of their moderately high thermal conductivity and liquid nature …

Thermal interface materials (TIMs) play a key role in reducing thermal resistance between
jointed solid surfaces in order to increase thermal transfer efficiency. A TIM is a thermally …

Liquid metals (LMs) offer extremely low thermal resistance, and have been studied as an
emerging thermal interface material (TIM). In this work, we propose an improved form of …

Thermal management has become a challenging aspect particularly in the field of
microelectronics due to rapid miniaturization and massive scale integration. This has …