Purpose–The purpose of this paper is to present a detailed overview of the current stencil
printing process for microelectronic packaging. Design/methodology/approach–This paper …

Transmission line pulsing (TLP) is well-established for the IV-characterization of electrostatic
discharge (ESD)-protection elements. There still is a significant gap between the …

This paper describes the application of computational fluid dynamics (CFD) to simulate the
macroscopic bulk motion of solder paste ahead of a moving squeegee blade in the stencil …

The thixotropic behaviour of different type lead-free solder pastes (Type 3: particle size: 20–
45 μm; Type 4: 20–38 μm; Type 5: 10–25 μm) was investigated and compared. The viscosity …

In pick and place (P&P) process of surface mount technology (SMT) the placed component
can shift from its ideal (or designed) position on the wet solder paste. The solder paste with …

Stencil printing of solder paste with sinusoidally vibrated squeegee is a new technique
developed in recent years used for the assembly of printed circuit boards (PCB's) in the …

Although silicon technology can be adopted for the fabrication of microfluidic devices with
high precision, the capital and operating costs for such technology is often prohibitively …

Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering
electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives …

The effects of printing force and different squeegee geometries on the process of stencil
printing were investigated in this paper. Numerical models were established, which included …

PbSn solders are used in semiconductor devices for aerospace or military purposes with
high levels of reliability requirements. Microalloying has been widely adopted to improve the …