The electronic industry faces a number of issues as a result of the rapid miniaturization of
electronic products and the expansion of application areas, with the reliability of electronic …

In recent years, in order to adapt to the trend of low-temperature assembly and integration,
low-temperature hybrid solders with multiple elements added to the tin solder matrix have …

To alleviate the problem of residual stress in silica glass/2024Al soldered joints, ultrasonic-
assisted soldering of silicon glass and 2024Al was carried out using Sn single bond Bi low …

In this paper, the elastoplastic and creep constitutive behaviors of sintered silver with varying
amounts of nickel-modified multiwall carbon nanotubes are studied through a systematic …

Lightweight carbon fibers with high mechanical performance are referred to as an ideal
reinforcement for an extensive variety of composite materials. However, the addition of …

Abstract In this study, 0.3 wt% Ti nanoparticles (Ti NPs) were incorporated into Sn1. 0Ag0.
5Cu (SAC105) solder, and vacuum thermo-compression soldering was employed to …

Abstract Background Lead-free solders (LFSs) involve incorporating trace elements into Sn,
resulting in alloys like Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and Sn-0.7 wt.% Cu (SC). These …

Abstract The Sn–Ag–Cu (SAC) solders with low Ag content have been identified as
promising candidates to replace the traditional Sn–Pb solder for flip-chip interconnects. This …

Micro solder joints experience various loads during operation, and the failure of a single
micro solder joint can impact the overall reliability of the entire microsystem. This study …

The influence of multi-walled carbon nanotube (MWCNT) content on the melting properties,
wettability, microstructure, and intermetallic compounds (IMCs) of Sn-58Bi-x MWCNT (x= 0 …