Copper metallization has emerged as the leading interconnect technology for deep sub-
micron features, where electroplating and chemical mechanical polish (CMP) processes …

The present invention relates to a chemical mechanical polishing composition for Surfaces
of a Semiconductor wafer, and more particularly, to a chemical mechanical polishing Slurry …

(57) ABSTRACT A chemical mechanical polishing slurry composition and method for using
the slurry composition for polishing copper, barrier material and dielectric material that com …

During the chemical mechanical polishing process (ie, CMP for short), it is expected to attain
the requirement of global planarization. However, the stress concentration, which occurred …

This thesis presents the nonlinear analysis, design, fabrication, and testing of an axial-gap
magnetic induction micro machine, which is a two-phase planar motor in which the rotor is …

In this paper, we analyze the nonuniformity of sliding distance on both the wafer and
polishing pad from a kinematic point of view. Using the Fourier series expansion, it can be …

Lapping and polishing are loose abrasive finishing processes that have been used to
achieve critical surface parameters in optical materials for centuries. These processes …

In this study, a three-dimensional finite element model was established to perform modal
analysis of the chemical mechanical polishing process. The contact boundary conditions …

A method to form a semiconductor taper without etching the taper surfaces. In one
embodiment, a semiconductor waveguide is formed on a workpiece having an unwatched …

A method to form a taper in a semiconductor layer. In one embodiment, the semiconductor
layer is formed on a cladding layer. A mask layer is formed on the semiconductor layer. The …