Heat and fluid flow in high-power LED packaging and applications
Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are
generated from LED chips and then transmitted or conducted through multiple packaging …
generated from LED chips and then transmitted or conducted through multiple packaging …
Thermal management of electronics: A review of literature
SS Anandan, V Ramalingam - Thermal science, 2008 - doiserbia.nb.rs
Due to rapid growth in semiconductor technology, there is a continuous increase of the
system power and the shrinkage of size. This resulted in inevitable challenges in the field of …
system power and the shrinkage of size. This resulted in inevitable challenges in the field of …
[图书][B] Handbook of electronic package design
M Pecht - 1991 - books.google.com
Both a handbook for practitioners and a text for use in teaching electronic packaging
concepts, guidelines, and techniques. The treatment begins with an overview of the …
concepts, guidelines, and techniques. The treatment begins with an overview of the …
Advances in thermal modeling of electronic components and systems. Volume 1
A Bar-Cohen, AD Kraus - New York, 1988 - ui.adsabs.harvard.edu
Recent advances in the analysis of heat transfer within and from electronic chip packages
and the design exploitation of the analytical results are discussed in a series of reviews …
and the design exploitation of the analytical results are discussed in a series of reviews …
[图书][B] Thermal computations for electronics: conductive, radiative, and convective air cooling
GN Ellison - 2020 - taylorfrancis.com
The first edition of Thermal Computations for Electronics: Conductive, Radiative, and
Convective Air Cooling was based on the author's lecture notes that he developed over the …
Convective Air Cooling was based on the author's lecture notes that he developed over the …
Ten years of boundary-condition-independent compact thermal modeling of electronic parts: A review
CJM Lasance - Heat Transfer Engineering, 2008 - Taylor & Francis
In order to reduce design-cycle time and physical prototyping, equipment manufacturers
need to ascertain the thermal performance of new systems at the earliest possible stage of …
need to ascertain the thermal performance of new systems at the earliest possible stage of …
Compact thermal models for electronic systems
MN Sabry - IEEE Transactions on components and packaging …, 2003 - ieeexplore.ieee.org
Compact thermal models have been constructed for different levels in electronic systems
with a variable degree of success. In this work first steps toward constructing a unifying …
with a variable degree of success. In this work first steps toward constructing a unifying …
A closed form solution of junction to substrate thermal resistance in semiconductor chips
FN Masana - IEEE Transactions on Components, Packaging …, 1996 - ieeexplore.ieee.org
The model presented in this work is based on an extension of the constant angle heat
spreading, taking into account chip and substrate dimensions, and changing the spreading …
spreading, taking into account chip and substrate dimensions, and changing the spreading …
Thermal characterization of electronic devices with boundary condition independent compact models
CJM Lasance, H Vinke, H Rosten - IEEE Transactions on …, 1995 - ieeexplore.ieee.org
The accurate prediction of operating temperatures of temperature-sensitive electronic parts
at the component-, board-, and system-level is seriously hampered by the tack of reliable …
at the component-, board-, and system-level is seriously hampered by the tack of reliable …
A novel approach for the thermal characterization of electronic parts
C Lasance, H Vinke, H Rosten… - Proceedings of 1995 …, 1995 - ieeexplore.ieee.org
The accurate prediction of operating temperatures of temperature sensitive electronic parts
at the component, board and system level is seriously hampered by the lack of reliable …
at the component, board and system level is seriously hampered by the lack of reliable …