Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
YC Huang, YX Lin, CK Hsiung, TH Hung, KN Chen - Nanomaterials, 2023 - mdpi.com
Advanced packaging technology has become more and more important in the
semiconductor industry because of the benefits of higher I/O density compared to …
semiconductor industry because of the benefits of higher I/O density compared to …
[PDF][PDF] Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application. Nanomaterials 2023 …
YC Huang, YX Lin, CK Hsiung, TH Hung, KN Chen - 2023 - academia.edu
Advanced packaging technology has become more and more important in the
semiconductor industry because of the benefits of higher I/O density compared to …
semiconductor industry because of the benefits of higher I/O density compared to …