The electronic equipment developing towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …

As demand for high-performance heat transfer increases, interest in microchannel heat sinks
as a viable solution for heat flux removal in thermal devices has grown significantly …

By increasing demands for high thermal performance and energy efficiency, attentions to
microchannel heat sinks (MCHSs) as the suitable method for heat flux dissipation from …

In the present study, an artificial neural network (ANN) was developed to predict the thermal
and hydrodynamic behavior of two types of Newtonian nanofluids used as coolants in a …

A numerical study was conducted aiming to examine the hydrothermal performance of a
heat sink having hemispherical pin fins (HSPFs) under fully turbulent flow conditions and to …

The present trend of miniaturization in various electronic devices has caused higher heat
generation per unit area. Dissipation of highly concentrated heat from these devices is …

Research on nanofluids has increased markedly in the last two decades. Initial attention has
focused on conventional or mono nanofluids, dispersions of one type of solid nano-sized …

The ever-increasing demand for electronic systems to enhance their performance and
processing speed has exponentially increased their heat generation, especially those …

The effect of four geometrical parameters (width of the offset ribs, depth of the offset ribs,
incline angle of the offset ribs, and distance between the adjacent offset ribs) on heat …