Differential extrapolation method for separating dielectric and rough conductor losses in printed circuit boards
A Koul, MY Koledintseva, S Hinaga… - IEEE Transactions on …, 2011 - ieeexplore.ieee.org
Copper foil in printed circuit board (PCB) transmission lines/interconnects is roughened to
promote adhesion to dielectric substrates. It is important to characterize PCB substrate …
promote adhesion to dielectric substrates. It is important to characterize PCB substrate …
Surface roughness modeling of substrate integrated waveguide in D-band
In this paper, surface roughness models for a substrate integrated waveguide (SIW) are
proposed. Frequency-dependent conductivity is introduced to model the conductor loss due …
proposed. Frequency-dependent conductivity is introduced to model the conductor loss due …
Polymer-based 3-D printed 140 to 220 GHz metal waveguide thru lines, twist and filters
This paper demonstrates the current state-of-the-art in low-cost, low loss ruggedized
polymer-based 3-D printed G-band (140 to 220 GHz) metal-pipe rectangular waveguide …
polymer-based 3-D printed G-band (140 to 220 GHz) metal-pipe rectangular waveguide …
Analytical model for resistivity and mean free path in on-chip interconnects with rough surfaces
Planar copper interconnects suffer from surface roughness that results in performance
degradation. This paper presents a novel analytical model for calculation effective resistivity …
degradation. This paper presents a novel analytical model for calculation effective resistivity …
Broadband characterization of coplanar waveguide interconnects with rough conductor surfaces
A Sain, KL Melde - IEEE Transactions on Components …, 2013 - ieeexplore.ieee.org
This paper presents a method to simulate the effects of conductor surface roughness on
conductor-backed coplanar waveguide (CB-CPW) interconnects using 3-D full wave …
conductor-backed coplanar waveguide (CB-CPW) interconnects using 3-D full wave …
Differential and extrapolation techniques for extracting dielectric loss of printed circuit board laminates
MY Koledintseva, A Koul, S Hinaga… - 2011 IEEE MTT-S …, 2011 - ieeexplore.ieee.org
The experiment-based differential and extrapolation techniques to extract frequency-
dependent dielectric loss of printed circuit board laminates are proposed. Separation of …
dependent dielectric loss of printed circuit board laminates are proposed. Separation of …
Chip-to-chip copper interconnects with rough surfaces: analytical models for parameter extraction and performance evaluation
In multigigahertz integrated circuit design, the extra delay and power losses due to surface
roughness in copper (Cu) interconnects is more evident than ever before and needs utmost …
roughness in copper (Cu) interconnects is more evident than ever before and needs utmost …
A study on the effects of ground via fences, embedded patterned layer, and metal surface roughness on conductor backed coplanar waveguide
A Sain - 2015 - search.proquest.com
Electrical engineers have responded to the increasing demand for circuit speed and
functionality by reducing transistor feature size and increasing on-chip transistor density …
functionality by reducing transistor feature size and increasing on-chip transistor density …
Design of energy-aware interconnects for next generation micro systems
This paper presents an overview of the problem of surface roughness in ultra-scaled Copper
(Cu) interconnects. It is seen that surface roughness can severely degrade the electrical and …
(Cu) interconnects. It is seen that surface roughness can severely degrade the electrical and …
Performance modeling and broadband characterization of chip-to-chip interconnects with rough surfaces
Planar copper interconnects suffer from surface roughness that results in their performance
degradation. In this paper, we investigate the role of rough conductor surfaces on the …
degradation. In this paper, we investigate the role of rough conductor surfaces on the …