This year marks about half a century since the birth of the technique known as the partial
element equivalent circuit modeling approach. This method was initially conceived to model …

Via transitions in high-speed channels critically influence the signal integrity and power
integrity of high-speed systems. In this article, a mode-decomposition-based equivalent …

The 3-D integration exacerbates the thermal issues over a single die due to the high-power
density and poor thermal conductivity of the adhesive layers in between the stackedup dies …

In this paper, we model multiple vias with irregular antipad in arbitrarily shaped 3-D
integrated circuit and packaging system based on generalized Foldy–Lax equations …

The China high-speed trains use cable trays to neatly arrange the cables running through
the distributed systems. On one hand, they protect cables against external electromagnetic …

In this article, a compact partial element equivalent circuit (c-PEEC) model is presented for
characterizing the electromagnetic (EM) problems with finite-sized piecewise homogeneous …

The partial element equivalent circuit (PEEC) method provides an electromagnetic model of
interconnections and packaging structures in terms of standard circuit elements. The surface …

A parallel-plate pair with complex shared antipad structures was analyzed by decomposing
it into rectangular local via structures and the plate pair region by virtual interfaces. The …

In this study, the structure that a stripline crosses with a narrow slot on the adjacent ground
plane was rigorously studied in both a signal integrity and an electromagnetic interference …

This paper discusses the behavior of the microstrip-to-via transition for high-speed
differential signaling considering the frequency range up to 100 GHz. In particular, the …