A transport-of-intensity equation (TIE)-based phase retrieval method is proposed with putting an arbitrarily shaped aperture into the optical wavefield. In this arbitrarily shaped aperture …
A Shanker, L Tian, M Sczyrba, B Connolly… - Applied …, 2014 - opg.optica.org
We report theoretical and experimental results for imaging of electromagnetic phase edge effects in lithography photomasks. Our method starts from the transport of intensity equation …
Transport of intensity equation (TIE) has been a popular and convenient phase imaging method that retrieves phase profile from the measurement of intensity differentials …
A Shanker, M Sczyrba, B Connolly… - Photomask …, 2015 - spiedigitallibrary.org
Mask topography contributes to phase at the wafer plane, even for OMOG binary masks currently in use at the 22nm node in deep UV (193nm) lithography. Here, numerical …
A Shanker, M Sczyrba, F Lange… - Optical …, 2015 - spiedigitallibrary.org
Mask topography contributes diffraction-induced phase near edges, affecting the through- focus intensity variation and hence the process window at the wafer. We analyze the impact …
Optical projection lithography is the predominant microlithography technique that is used in the semiconductor fabrication process. It uses light to transfer the information from a …
Stochastic effects in extreme ultraviolet lithography are contributed by the EUV optical speckle and diffusion chemistry of the photoresist. These cause line edge roughness (LER) …