[HTML][HTML] Experimental investigation for thermal performance enhancement of various heat sinks using Al2O3 NePCM for cooling of electronic devices
Electronic devices are being used extensively for different applications, where the thermal
management of these devices is still a critical challenge due to rapid miniaturization, high …
management of these devices is still a critical challenge due to rapid miniaturization, high …
Experimental investigation of the twist angle effects on thermo-hydraulic performance of a square and hexagonal pin fin array in forced convection
This research deals with an experimental investigation to manage the thermo-hydraulic
performance of the heat sink with pin fin array under forced convection at various design …
performance of the heat sink with pin fin array under forced convection at various design …
Experimental investigation of orientation and geometry effect on additive manufactured aluminium LED heat sinks under natural convection
R Tucker, M Khatamifar, W Lin, K McDonald - Thermal Science and …, 2021 - Elsevier
The continued adaptation of light-emitting diodes (LEDs) presents challenges for heat
dissipation. LEDs are considered to be high power density devices, as such effective …
dissipation. LEDs are considered to be high power density devices, as such effective …
[HTML][HTML] Isopropanol-Acetone-Hydrogen chemical heat pumps for improved heat recovery from geothermal resources, A case study in China
This study focuses on geothermal energy utilization through multi-objective optimization of
Isopropanol-Acetone-Hydrogen chemical heat pump (IAH-CHP). In this paper, IAH-CHP …
Isopropanol-Acetone-Hydrogen chemical heat pump (IAH-CHP). In this paper, IAH-CHP …
On the performance of an innovative electronic chipset thermal management module based on energy storage unit concept utilizing nano-additive phase change …
Due to size minimization and increment in the frequency of electronic devices, efficient and
reliable methods for thermal management are required to reduce operating temperature …
reliable methods for thermal management are required to reduce operating temperature …
Tuning surface wettability of aluminum surface and its correlation with short and long term corrosion resistance in saline solutions
In this work, we fabricated superhydrophilic aluminum alloy (AA 6063) with a hierarchical
labyrinth-like structure using a facile and environmentally benign chemical etching method …
labyrinth-like structure using a facile and environmentally benign chemical etching method …
[HTML][HTML] Heat transfer optimisation using novel biomorphic pin-fin heat sinks: An integrated approach via design for manufacturing, numerical simulation, and machine …
With the availability of advanced manufacturing techniques, non-conventional shapes and
bio-inspired/biomorphic designs have shown to provide more efficient heat transfer …
bio-inspired/biomorphic designs have shown to provide more efficient heat transfer …
Synergistic effect of active-passive methods using fins surface roughness and fluid flow for improving cooling performance of heat sink heat pipes
T Ghazi, MR Attar, A Ghorbani… - Experimental Heat …, 2024 - Taylor & Francis
The continued depreciation of electronic components presents severe challenges for
thermal management. Regarding this issue, the current experimental study targets to …
thermal management. Regarding this issue, the current experimental study targets to …
Investigation on strength and fracture mechanism of aluminum plate-fin structures at cryogenic temperature
H Ma, S Wang, J Wang, Y Xie, P Zhong, W Cai… - Engineering Failure …, 2023 - Elsevier
In order to improve the service life of aluminum plate-fin heat exchangers and prevent them
from thermal stress damage at cryogenic temperature, the strength and fracture mechanism …
from thermal stress damage at cryogenic temperature, the strength and fracture mechanism …
Fabrication and experimental characterization of a modified heat-sink based on a semi-active/passive cooling strategy with fluid flow and nano-enhanced phase …
F Najafi, D Ramezani, S Sheykh, A Aldaghi… - … Communications in Heat …, 2021 - Elsevier
This paper aims to assess the thermal management of a printed circuit board (PCB), as an
electronic chipset, with the aid of a mini-channel heat-sink utilizing fluid flow and nano …
electronic chipset, with the aid of a mini-channel heat-sink utilizing fluid flow and nano …