Repairability of Additively Printed Circuits Using Sustainable Aqueous-Based Silver Nanoparticle Ink on Polyimide Substrates
P Lall, D Karakitie, S Miller - 2024 23rd IEEE Intersociety …, 2024 - ieeexplore.ieee.org
The electronics industry is focusing on sustainable processes with a reduced carbon
footprint. The emergence of water-based low-impact waste inks for additive circuits poses an …
footprint. The emergence of water-based low-impact waste inks for additive circuits poses an …
Performance Analysis of Screen-Printed Functional Circuits on Biodegradable PET Substrates Using Low-Temperature ECA for SMD Component Attachment
P Lall, S Kulkarni, S Miller - 2024 23rd IEEE Intersociety …, 2024 - ieeexplore.ieee.org
Non-sustainable substrates, such as PET and PI, are used for the additive fabrication of FHE
due to their excellent thermal, dimensional stability, and mechanical strength. However, their …
due to their excellent thermal, dimensional stability, and mechanical strength. However, their …
Screen-Printed Thermoformed Circuits Performance and Reliability under Sustained High Temperatures for In-Mold Electronics
P Lall, S Kulkarni, S Miller - 2024 23rd IEEE Intersociety …, 2024 - ieeexplore.ieee.org
In-mold electronics holds the promise of lightweighting on the automotive platform for a
reduced carbon footprint. The integration of the human-machine interface can be achieved …
reduced carbon footprint. The integration of the human-machine interface can be achieved …
Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component …
P Lall, S Kulkarni, S Miller - International …, 2024 - asmedigitalcollection.asme.org
Non-sustainable substrates, such as PET and PI, are used for the additive fabrication of FHE
due to their excellent thermal, dimensional stability, and mechanical strength. However, their …
due to their excellent thermal, dimensional stability, and mechanical strength. However, their …
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under …
P Lall, S Kulkarni, S Miller - International …, 2024 - asmedigitalcollection.asme.org
In-mold electronics offers a path toward reducing the carbon footprint in automotive
platforms through weight reduction. This technology enables the integration of human …
platforms through weight reduction. This technology enables the integration of human …