Cloud auto-scaling with deadline and budget constraints

M Mao, J Li, M Humphrey - 2010 11th IEEE/ACM International …, 2010 - ieeexplore.ieee.org
Clouds have become an attractive computing platform which offers on-demand computing
power and storage capacity. Its dynamic scalability enables users to quickly scale up and …

[图书][B] Statistical design of experiments with engineering applications

K Rekab, M Shaikh - 2005 - api.taylorfrancis.com
In today's high-technology world with flourishing e-Business and intense competition at a
global level, the search for competitive advantage has become a crucial task of corporate …

Statistical methods for the estimation of process variation effects on circuit operation

AA Mutlu, M Rahman - IEEE Transactions on Electronics …, 2005 - ieeexplore.ieee.org
In this paper, a technology computer-aided design (TCAD) driven method for accurate
prediction of the performance spread of integrated circuits due to process variations is …

DOE/Opt: A system for design of experiments, response surface modeling, and optimization using process and device simulation

DS Boning, PK Mozumder - IEEE Transactions on …, 1994 - ieeexplore.ieee.org
Rapid modeling and optimization of manufacturing processes, devices, and circuits are
required to support modern integrated circuit technology development and yield …

[图书][B] Технология, конструкции и методы моделирования кремниевых интегральных микросхем. Часть 2

М Королев, Т Крупкина, М Путря, В Шевяков - 2014 - books.google.com
Часть вторая. Элементы и маршруты изготовления кремниевых ИС и методы их
математического моделирования. Дано представление об основных маршрутах …

A new device design methodology for manufacturability

JC Lu, WC Holton, JS Fenner… - … on Electron Devices, 1998 - ieeexplore.ieee.org
As future technology generations for integrated circuits continue to" shrink", TCAD tools must
be made more central to manufacturing issues; thus, yield optimization and design for …

Statistical many-dimensional simulation of VLSI technology based on response surface methodology

MV Kazitov, WB Kuzmicz, VV Nelayev… - … in Science and …, 2000 - spiedigitallibrary.org
With increasing IC packing density IC manufacturing processes are becoming more and
more complex and tolerances of process parameters more critical for production yield and …

Silicon nitride deposition process for low cost microelectronics applications

TJ Sanders, EL Caraway, C Hall… - Proceedings of the …, 1997 - ieeexplore.ieee.org
A new technique for Plasma Enhanced Chemical Vapor Deposition (PECVD) of silicon
nitride is presented in this paper. This technique involves specially built equipment which …

A manufacturing sensitivity analysis of 0.35/spl mu/m LDD MOSFET's

K Hasnat, S Murtaza, AF Tasch - IEEE transactions on …, 1994 - ieeexplore.ieee.org
Fundamental to successful manufacturing of integrated circuits is the achievement of
sufficient control in all process steps to realize, with very high yield, fully functional circuits …

Silicon Correlation in SLM: An Integrated Strategy for Chip Performance Optimization

A Das, LK Thota, A Kavukuntla… - 2024 IEEE 8th …, 2024 - ieeexplore.ieee.org
Ever increasing complexities and performance requirements of chips necessitates paradigm
shift from our traditional approaches. This translates into the need for continuous monitoring …