Parameter changes in the complex internal structure of multi-layer 3D stacked chips will
greatly reduce the efficiency of modeling and thermal analysis. In this work, by combining …

Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization
of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal …

Static chip thermal analysis provides detailed and accurate thermal profile on chip. The chip
power map, commonly modeled as rectangular regions of distinct heat sources, significantly …

Obtaining the steady-state temperature distribution of FPGA chip is the basis to build the
thermal monitoring mechanism for reliable system performance. Existing work employs the …

Thermal simulation plays a crucial role in various fields, often involving complex partial
differential equation (PDE) simulations for thermal optimization. To tackle this challenge, we …

Full-chip transient thermal simulation, which is essential for solving pressing thermal issues,
is time-consuming and resource-intensive, especially when nonlinear effects including …

With the rapid increase of the transistor number in VLSI, rapidly rising power density and
temperatures make heat dissipation a major challenge in IC design and manufacturing …

The design of package interconnects is increasingly vital as integrated circuits (ICs) continue
to shrink in size and increase in density. However, reducing interconnect size may lead to …

A large on-chip peak temperature and thermal gradient, caused by localized hotspots and
cross-die thermal coupling, can severely impact transistor performance, stress, aging …

Thermal limitations play a significant role in modern integrated chips (ICs) design and
performance. 3D integrated chip (3DIC) makes the thermal problem even worse due to a …