Clip bonding technology is widely and increasingly used in microelectronic packages
because of the increasing demand for high power and low loss automotive grade power …

Solder joint fatigue crack is one of the key failure modes in IC packaging, particularly for
power packages under a thermal cycling test (TCT). Design optimization and material …

The need for modernization of existing energy sector is driven by globally increasing energy
demand, rising carbon emissions, global warming and climate change. The world tends …

This chapter deals with the reliability of die interconnections used in plastic discrete power
packages, dedicated to on-board electronic systems used in a wide range of applications …

yy'da teknolojik yenilik süreçleri, anlaşılması ve yönetilmesi oldukça karmaşık ilişki ağları ile
çevrilidir. Teknolojik yeniliklerin artık sadece üretimin ve gelişmenin bir faktörü olarak değil …