With the development of science and technology, microelectronic components have evolved
to become increasingly integrated and miniaturized. As a result, thermal management …

The space environment raises many challenges for new materials development and ground
characterization. These environmental hazards in space include solar radiation, energetic …

Ceramic aerogels with recoverable compressibility, super-insulation capacity, and
remarkable thermal and chemical stability are fascinating for use in the field of high-level …

The rational introduction of multi-components to fabricate electromagnetic wave absorbing
(EMA) materials with synergistic conductive/dielectric/magnetic losses promises …

The integration and miniaturization of chips lead to inevitable overheating and increasing
electromagnetic interference (EMI) problems, which threaten the performance, stability, and …

Thermally conductive but electrically insulating polymer composites are highly desirable for
thermal management applications because of their wide range of utilization, ease of …

Urged by the increasing power and packing densities of integrated circuits and electronic
devices, efficient dissipation of excess heat from hot spot to heat sink through thermal …

As the power density and integration level of electronic devices increase, there are growing
demands to improve the thermal conductivity of polymers for addressing the thermal …

Owing to the growing heat removal issue in modern electronic devices, electrically insulating
polymer composites with high thermal conductivity have drawn much attention during the …

Fluorinated graphene, an up‐rising member of the graphene family, combines a two‐
dimensional layer‐structure, a wide bandgap, and high stability and attracts significant …