This paper presents an in-depth overview of the present status and novel developments in
the field of plasma processing of low dielectric constant (low-k) materials developed for …

This paper reviews the mechanical and fracture properties of porous ultralow-k dielectrics
with the focus on chip package interaction related issues. It is shown that the mechanical …

An increase in resistance and capacitance (RC) delay has been a critical issue in reducing
integrated circuit scales. The delay is successfully reduced using low dielectric constant (κ) …

The developments in advanced interconnect technology for semiconductor logic devices for
the mitigation of plasma‐induced damage to low‐dielectric‐constant (low‐k) materials …

Limited by the intrinsic strong bonds between the composing atoms, engineering materials
are plagued by the inevitable trade-offs among thermo-mechanical strength, toughness, and …

This paper presents an in-depth overview of the application and impact of UV/VUV light in
advanced interconnect technology. UV light application in BEOL historically was mainly …

Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

Reducing the delay of backend interconnects is critical in delivering improved performance
in next generation computer chips. One option is to implement interlayer dielectric (ILD) …

We review the latest studies that address the fundamental understanding of low-k dielectric
electrical properties and reliability. We focus on the results discussing the nature of process …

Modification of ultra-low-k films by extreme ultraviolet (EUV) and vacuum ultraviolet (VUV)
emission with 13.5, 58.4, 106, 147 and 193 nm wavelengths and fluences up to 6× 10 18 …