This review highlights the development of energy saving transparent heat regulating (THR)
materials and coating for energy saving window applications. Current state-of-the-art …

The coating of complex three-dimensional structures with ultrathin metal films is of great
interest for current technical applications, particularly in microelectronics, as well as for basic …

Atomic layer deposition (ALD) has become an indispensable thin-film technology in the
contemporary microelectronics industry. The unique self-limited layer-by-layer growth …

Nanoparticulate gold is a useful material being used in applications like gas-sensing, 1
heterogeneous catalysis, 2 and by virtue of its surface plasmon resonance, photonics. 3 …

The metallization of polyimide (PI) remains a formidable challenge when using an atomic
layer deposition of copper. The present study employs Cu (hfac) 2 and Et 2 Zn to deposit the …

Agglomeration is a critical issue for depositing copper (Cu) thin films, and therefore, the
deposition should be preferably performed below 100° C. This work explores an atomic …

One field of organometallic and materials chemistry that has seen great advancements over
the last 20 years is that of atomic layer deposition (ALD), and in particular the development …

The molecular details of the atomic layer deposition (ALD) of metallic copper on silicon
oxide substrates using metallorganic precursors, iminopyrrolidinate complexes in particular …

Herein, we describe a process for the low-temperature atomic layer deposition of copper
using Cu (dmap) 2 (dmap= dimethylamino-2-propoxide). The use of tertiary butyl hydrazine …

The present work is regarding the study of double zone thermal chemical vapor deposition
(CVD) and plasma enhanced chemical vapor deposition (PECVD) systems. Here, we have …