New Reliability Assessment of MEMS Components under Accumulative Testing for Space Applications
M Auchlin - 2021 - infoscience.epfl.ch
This dissertation proposes a novel accumulative test method for MEMS-based, commercial
off-the-shelves inertial measure units (IMUs) from the automotive field. The need for …
off-the-shelves inertial measure units (IMUs) from the automotive field. The need for …
Thermo-mechanical problems and their solution in a 3D micro-electronics package using Cu-to-Cu direct bonding
AY Park - 2017 - search.proquest.com
Abstract Three-dimensional (3D) integration is one of promising solutions to obtain high I/O
and smaller package in the microelectronics industry. Associated with 3D package …
and smaller package in the microelectronics industry. Associated with 3D package …