Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications
Rapid advancements in nanotechnologies for energy conversion and transport applications
urgently require a further understanding of interfacial thermal transport and enhancement of …
urgently require a further understanding of interfacial thermal transport and enhancement of …
A critical review of thermal boundary conductance across wide and ultrawide bandgap semiconductor interfaces
The emergence of wide and ultrawide bandgap semiconductors has revolutionized the
advancement of next-generation power, radio frequency, and opto-electronics, paving the …
advancement of next-generation power, radio frequency, and opto-electronics, paving the …
A review of thermoreflectance techniques for characterizing wide bandgap semiconductors' thermal properties and devices' temperatures
Thermoreflectance-based techniques, such as pump–probe thermoreflectance (pump–
probe TR) and thermoreflectance thermal imaging (TTI), have emerged as the powerful and …
probe TR) and thermoreflectance thermal imaging (TTI), have emerged as the powerful and …
High throughput nanoimaging of thermal conductivity and interfacial thermal conductance
Thermal properties of materials are often determined by measuring thermalization
processes; however, such measurements at the nanoscale are challenging because they …
processes; however, such measurements at the nanoscale are challenging because they …
Near-interface effects on interfacial phonon transport: Competition between phonon-phonon interference and phonon-phonon scattering
Recent studies suggest that the phonon-phonon couplings in the near-interface region may
affect interfacial thermal transport. In this paper, we revisit the interfacial thermal transport …
affect interfacial thermal transport. In this paper, we revisit the interfacial thermal transport …
Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics
Heterogeneous integration is important to create multi-functionality in future electronic
devices. However, few thermal studies of the interfaces formed in these integrated devices …
devices. However, few thermal studies of the interfaces formed in these integrated devices …
Thermal Management Modeling for β-Ga2O3-Highly Thermal Conductive Substrates Heterostructures
The ultrawide-bandgap (UWBG)(~ 4.8 eV) semiconductor-gallium oxide (-Ga 2 O 3) gives
promise to the next generation of high-power electrical devices owing to its high-power …
promise to the next generation of high-power electrical devices owing to its high-power …
Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States
N Chen, K Yang, Z Wang, B Zhong… - … Applied Materials & …, 2023 - ACS Publications
Interfacial bonding that directly influences the functional and mechanical properties of
metal/nonmetal composites is commonly estimated by destructive pull-off measurements …
metal/nonmetal composites is commonly estimated by destructive pull-off measurements …
Measurements of thermal resistance across buried interfaces with frequency-domain thermoreflectance and microscale confinement
Confined geometries are used to increase measurement sensitivity to thermal boundary
resistance at buried SiO2 interfaces with frequency-domain thermoreflectance (FDTR). We …
resistance at buried SiO2 interfaces with frequency-domain thermoreflectance (FDTR). We …
Orientation independent heat transport characteristics of diamond/copper interface with ion beam bombardment
K Yang, Z Zhang, H Zhao, B Yang, B Zhong, N Chen… - Acta Materialia, 2021 - Elsevier
Owing to high thermal conductivity (k) and appropriate coefficient of thermal expansion
(CTE), Diamond/copper (Dia/Cu) composites have attracted extensive attention as …
(CTE), Diamond/copper (Dia/Cu) composites have attracted extensive attention as …