632 include a dielectric region contacting at least the top Surface of the microelectronic
element. The dielectric region can have a planar surface located coplanar with or above the …

A stacked microelectronic assembly is fabricated from a structure which includes a plurality
of first microelectronic elements having front faces bonded to a carrier. Each first …

(56) References Cited 2004/0043607 A1 3/2004 Farnworth et al. 2004/0051173 A1 3, 2004
Koh et al. US PATENT DOCUMENTS 2004/006 1238 A1 4/2004 Sekine 2004/0104454 A1 …

(57) ABSTRACT A microelectronic unit includes a microelectronic element, eg, an integrated
circuit chip, having a semiconductor region of monocrystalline form. The semiconductor …

A stacked microelectronic assembly is provided which includes first and second stacked
microelectronic elements. Each of the first and second microelectronic elements can include …

6,573,592 B2 6, 2003 Bolken 2009/0079067 A1 3/2009 Gerber 6,600,231 B2 7/2003
Tominaga 2009/0284631 A1 11/2009 Matsuo et al. 6,659,512 B1 12/2003 Harper et al …

(57) ABSTRACT A microelectronic assembly includes first and second stacked
microelectronic elements, each having spaced apart traces extending along a front face and …

A microelectronic unit can include a substrate having front and rear surfaces and active
semiconductor devices therein, the substrate having a plurality of openings arranged in a …

A solid state image sensor includes a microelectronic element having a front face and a rear
face remote from the front face, the rear face having a recess extending towards the front …

(57) ABSTRACT A method of making a stacked microelectronic package by forming a
microelectronic assembly by Stacking a first Sub assembly including a plurality of …