Electronic surface and dielectric interface states on GaN and AlGaN

BS Eller, J Yang, RJ Nemanich - … of Vacuum Science & Technology A, 2013 - pubs.aip.org
GaN and AlGaN have shown great potential in next-generation high-power electronic
devices; however, they are plagued by a high density of interface states that affect device …

State of the art on gate insulation and surface passivation for GaN-based power HEMTs

T Hashizume, K Nishiguchi, S Kaneki, J Kuzmik… - Materials science in …, 2018 - Elsevier
In this article, we review recent progress on AlGaN/GaN and InAlN/GaN metal-insulator-
semiconductor high-electron-mobility transistors (MIS-HEMTs) using Al-based oxides, nitride …

Control of threshold voltage of AlGaN/GaN HEMTs by fluoride-based plasma treatment: From depletion mode to enhancement mode

Y Cai, Y Zhou, KM Lau, KJ Chen - IEEE transactions on electron …, 2006 - ieeexplore.ieee.org
This paper presents a method with an accurate control of threshold voltages (V th) of
AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma …

GaN metal-oxide-semiconductor high-electron-mobility-transistor with atomic layer deposited Al2O3 as gate dielectric

PD Ye, B Yang, KK Ng, J Bude, GD Wilk… - Applied Physics …, 2005 - pubs.aip.org
We report on a GaN metal-oxide-semiconductor high-electron-mobility-transistor (MOS-
HEMT) using atomic-layer-deposited (ALD) Al 2 O 3 as the gate dielectric. Compared to a …

Capacitance–voltage characteristics of Al2O3/AlGaN/GaN structures and state density distribution at Al2O3/AlGaN interface

C Mizue, Y Hori, M Miczek… - Japanese Journal of …, 2011 - iopscience.iop.org
The potential modulation and interface states of Al 2 O 3/Al 0.25 Ga 0.75 N/GaN structures
prepared by atomic layer deposition (ALD) were characterized by capacitance–voltage (C …

Effective passivation of AlGaN/GaN HEMTs by ALD-grown AlN thin film

S Huang, Q Jiang, S Yang, C Zhou… - IEEE Electron Device …, 2012 - ieeexplore.ieee.org
An effective passivation technique for AlGaN/GaN high-electron-mobility transistors (HEMTs)
is presented. This technique features an AlN thin film grown by plasma-enhanced atomic …

Present status and future prospect of widegap semiconductor high-power devices

H Okumura - Japanese journal of applied physics, 2006 - iopscience.iop.org
High-power device technology is a key technological factor for wireless communication,
which is one of the information network infrastructures in the 21st century, as well as power …

GaN integration technology, an ideal candidate for high-temperature applications: A review

A Hassan, Y Savaria, M Sawan - IEEE Access, 2018 - ieeexplore.ieee.org
In many leading industrial applications such as aerospace, military, automotive, and deep-
well drilling, extreme temperature environment is the fundamental hindrance to the use of …

Characterization of interface states in Al2O3/AlGaN/GaN structures for improved performance of high-electron-mobility transistors

Y Hori, Z Yatabe, T Hashizume - Journal of Applied Physics, 2013 - pubs.aip.org
We have investigated the relationship between improved electrical properties of Al 2 O
3/AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) …

Investigations of HfO2∕ AlGaN∕ GaN metal-oxide-semiconductor high electron mobility transistors

C Liu, EF Chor, LS Tan - Applied physics letters, 2006 - pubs.aip.org
We report the studies of Al Ga N∕ Ga N metal-oxide-semiconductor high electron mobility
transistors (MOS-HEMTs) using reactive-sputtered Hf O 2 as the gate dielectric and the …