Representative implementations of techniques and methods include processing singulated
dies in preparation for bond ing. A plurality of semiconductor die components may be …

Methods for hybrid bonding include depositing and patterning a dielectric layer on a
substrate to form openings in the dielectric layer, depositing a barrier layer over the dielectric …

Layer structures for making direct metal-to-metal bonds at low temperatures and shorter
annealing durations in microelectronics are provided. Example bonding interface structures …

2018-02-20 Assigned to INVENSAS BONDING TECHNOLOGIES, INC. reassignment
INVENSAS BONDING TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST …

Representative techniques and devices including process steps may be employed to
mitigate the potential for delamination of bonded microelectronic substrates due to metal …

(57) ABSTRACT A bonded structure can include a first element having a first interface
feature and a second element having a second interface feature. The first interface feature …

US11195748B2 - Interconnect structures and methods for forming same - Google Patents
US11195748B2 - Interconnect structures and methods for forming same - Google Patents …

A stacked and electrically interconnected structure is disclosed. The structure can comprise
a first element and a second element directly bonded to the first element along a bonding …

Direct-bonded lamination for improved image clarity in optical devices is provided. An
example process planarizes and plasma-activates optical surfaces to be laminated together …

An integrated device package is disclosed. The integrated device package can include an
integrated device die, an element, a cavity, and an electrical interconnect. The ele ment can …