[PDF][PDF] 先进电子封装中焊点可靠性的研究进展
高丽茵， 李财富， 刘志权， 孙蓉 - 机械工程学报, 2022 - qikan.cmes.org
在先进封装中器件小型化的趋势下, 焊点所处的服役环境越加苛刻, 这对焊点材料提出了更高的
可靠性要求. 为保证微小尺寸焊点的可靠性, 具有较强扩散阻挡能力的铁镍 …
可靠性要求. 为保证微小尺寸焊点的可靠性, 具有较强扩散阻挡能力的铁镍 …
Graphene as a diffusion barrier at the interface of Liquid–State low-melting Sn–58Bi alloy and copper foil
Graphene is widely used as a barrier at the solid–solid and gas–solid state interface.
However, the use of graphene as a barrier at the liquid–solid interface has been rarely …
However, the use of graphene as a barrier at the liquid–solid interface has been rarely …
Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0 Ag-0.5 Cu and interlayer formation of multi-element intermetallic …
High-entropy alloy (HEA) FeCoNiCu (FCNC) can be potentially employed in electronic
packaging because it contains commonly used substrate metals. However, its …
packaging because it contains commonly used substrate metals. However, its …
Numerical and experimental study on laser soldering process of SnAgCu lead-free solder
Z Yang, L Li, W Chen, X Jiang, Y Liu - Materials Chemistry and Physics, 2021 - Elsevier
Laser soldering has been widely used in the connection of the electronic components and
printed circuit boards. Normally, the temperature and thermal stress of solder joints …
printed circuit boards. Normally, the temperature and thermal stress of solder joints …
Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock
R Tian, Y Tian, Y Huang, D Yang, C Chen… - Journal of Materials …, 2021 - Springer
The interfacial reactions and the growth behavior of interfacial intermetallic compounds
(IMCs), as well as their effects on the mechanical properties of the Sn-3.0 Ag-0.5 Cu …
(IMCs), as well as their effects on the mechanical properties of the Sn-3.0 Ag-0.5 Cu …
Thermomigration suppression in Sn3. 5Ag solder joints by hot-end FeCoNiMn alloy
Temperature gradient is inevitable in solder joints in advanced electronic packaging; it
induces thermomigration (TM), critically affecting the reliability of micro solder joints …
induces thermomigration (TM), critically affecting the reliability of micro solder joints …
Effect of Cu on the interfacial reaction between Sn-based solders and FeCoNiCu alloys
We examined the interfacial reactions between Sn–3.0 Ag–0.5 Cu (SAC305)/FeCoNiCu
(FCNC), SAC305/Cu-rich FCNC, and Sn3. 5Ag (SA3. 5)/FCNC alloys. FCNC and Cu-rich …
(FCNC), SAC305/Cu-rich FCNC, and Sn3. 5Ag (SA3. 5)/FCNC alloys. FCNC and Cu-rich …
Diffusion barrier properties of the intermetallic compound layers formed in the Pt nanoparticles alloyed Sn-58Bi solder joints reacted with ENIG and ENEPIG surface …
H Choi, CL Kim, Y Sohn - Materials, 2022 - mdpi.com
Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-
immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold …
immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold …
Intense Pulsed Light Soldering of Sn–3.0 Ag–0.5 Cu Ball Grid Array Component on Au/Pd (P)/Ni (P) Surface‐Finished Printed Circuit Board and Its Drop Impact …
E Ha, KD Min, S Lee, JS Hwang… - Advanced …, 2023 - Wiley Online Library
Intense pulsed light (IPL) soldering is investigated as an alternative soldering process to
conventional reflow soldering. IPL soldering is suitable for achieving a carbon‐neutral …
conventional reflow soldering. IPL soldering is suitable for achieving a carbon‐neutral …
[PDF][PDF] Research progress on the reliability of solder joint for advanced microelectronic packaging
高丽茵， 李财富， 刘志权， 孙蓉 - Journal of Mechanical Engineering, 2022 - qikan.cmes.org
Under the trend of miniaturization of microelectronic devices, the serving environment of
solder joints becomes severer, which requires a higher reliability of materials. To ensure the …
solder joints becomes severer, which requires a higher reliability of materials. To ensure the …