Solder joint, crucial component in electronic systems, face significant challenges when exposed to extreme conditions during applications. The solder joint reliability involving …
N Ismail, WYW Yusoff, NFNM Lehan… - Journal of Materials …, 2024 - Springer
Abstract Sn-Ag-Cu-based solder alloys are extensively employed in electronic packaging applications, thus necessitating in-depth reliability studies in various environmental …
This study utilises nanoindentation testing to investigate the impact of varying gamma radiation doses on the micromechanical properties of Sn-Ag-Cu (SAC) alloy. Specifically …