Increasing data rates, spectrum efficiency, and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to …
W Hong, ZH Jiang, C Yu, D Hou… - IEEE Journal of …, 2021 - ieeexplore.ieee.org
Ever since the deployment of the first-generation of mobile telecommunications, wireless communication technology has evolved at a dramatically fast pace over the past four …
A comprehensive guide to 5G technology, applications and potential for the future 5G brings new technology solutions to the 5G mobile networks including new spectrum options, new …
As 5G New Radio (NR) is being rolled out, research effort is being focused on the evolution of what is to come in the post-5G era. In order to meet the diverse requirements of future …
K Kibaroglu, M Sayginer, T Phelps… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
This paper presents a 64-element 28-GHz phasedarray transceiver for 5G communications based on 2× 2 transmit/receive (TRX) beamformer chips. Sixteen of the 2× 2 TRX chips are …
Y Zhang, J Mao - Proceedings of the IEEE, 2019 - ieeexplore.ieee.org
Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device, represents an important …
This article presents the first 39-GHz phased-array transceiver (TRX) chipset for fifth- generation new radio (5G NR). The proposed transceiver chipset consists of 4 sub-array …
J Pang, R Wu, Y Wang, M Dome, H Kato… - IEEE Journal of Solid …, 2019 - ieeexplore.ieee.org
This paper presents a 28-GHz CMOS four-element phased-array transceiver chip for the fifth- generation mobile network (5G) new radio (NR). The proposed transceiver is based on the …
X Gu, D Liu, B Sadhu - IEEE Journal of Microwaves, 2021 - ieeexplore.ieee.org
This article reviews current research and development as well as future opportunities for packaging and antenna integration technologies for silicon-based millimeter-wave phased …