3D-MID technology for surface modification of polymer-based composites: a comprehensive review
The three-dimensional molded interconnected device (3D-MID) has received considerable
attention because of the growing demand for greater functionality and miniaturization of …
attention because of the growing demand for greater functionality and miniaturization of …
Laser micro-drilling process: experimental investigation, modeling based on RSM-BBD tool and multi-criteria optimization
B Bachy - Journal of the Brazilian Society of Mechanical Sciences …, 2023 - Springer
The laser micro-drilling (LMD) process is one of the nontraditional machining processes
most widely used for producing micro-holes, complicated shapes, and geometries. The …
most widely used for producing micro-holes, complicated shapes, and geometries. The …
Effect of Filler Content on Flexural and Viscoelastic Properties of Coir Fibers and Argania Nut-shells Reinforced Phenolic Resin Composites
H Bensalah, M Raji, K Gueraoui, A Khtira… - Journal of Bionic …, 2022 - Springer
The characteristics of two different kinds of lignocellulosic materials (vegetable fillers) with
two morphologies as Argania nut-shells (ANS) particles and Coir Fibers (CF) were used as …
two morphologies as Argania nut-shells (ANS) particles and Coir Fibers (CF) were used as …
Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices
F Häußler, S Petillon, J Dornheim… - … Spring Seminar on …, 2020 - ieeexplore.ieee.org
Increasing demands regarding reliability of mechatronic systems and the aim for
miniaturization require new materials and processes for the 3D mechatronic interconnect …
miniaturization require new materials and processes for the 3D mechatronic interconnect …
Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging
F Häußler, S Shen, S Petillon… - International …, 2020 - meridian.allenpress.com
Miniaturization efforts and increasing demands regarding reliability of mechatronic systems
require new materials and processes for the 3D mechatronic integrated devices (3D-MID) …
require new materials and processes for the 3D mechatronic integrated devices (3D-MID) …
[PDF][PDF] Complex Permittivity of Advanced Dielectrics Across the 6G Frequency Band
MP Mcgarry - 2022 - utd-ir.tdl.org
As industry moves to higher frequencies with the use of 5G telecommunication (up to 38
GHz) and automotive radar (up to 77 GHz), electrical characteristics for a wide range of …
GHz) and automotive radar (up to 77 GHz), electrical characteristics for a wide range of …