Adoption of Chip-to-Chip (C2C) and Chip-to-Wafer (C2W) thermocompression (TC) flip-chip
(FC) bonding in high volume manufacturing of advanced memory modules is accelerating …

A performance testing method of the Bernoulli picker which can handle an ultra-thin die
without contact are formulated, and a series of experiments are conducted to evaluate and …

As demand for smaller and faster electronic products increases rapidly, 3D packaging with
higher electrical performance and density are desirable [1]. Flip chip interconnection …

Thermocompression bonding (TCB) is an advantageous method adapted for system
miniaturization, for instance to assemble microelectronic devices in 3D stacks. Low …

Thermo-compression bonding (TCB) is an important electronic packaging process which
applies heat and pressure to form arrayed interconnections in simultaneity. TCB processes …

This study investigated the relations between base resins and flux compounds applied to
NCF (Non Conductive film) for thermal compression bonding with micro Cu pillar bumps. As …

This paper focuses on numerical computation and experimental examination of Bernoulli
picker, which is the essential module for the 3D stacking process for heterogeneous …

With the rapid development of artificial intelligence and high-end servers, demands for high
bandwidth memory (HBM) and 3D stacked dynamic random access memory (3DS DRAM) is …

RÉSUMÉ L'un des grands défis de la recherche et développement est d'optimiser
l'ensemble du cycle de fabrication d'un produit microélectronique, depuis sa conception …

Flex-on-substrate assembly is an increasingly popular electronics assembly type that is
based on thermocompression bonding: a combination of high temperature and pressure …